He Tingbo, president of Huawei‘s semiconductors business department, recently outlined a design methodology set to be used in its upcoming Kirin chips.
She backed this approach to provide the means for the company to continue to deliver cutting-edge silicon for mobile devices.
In a speech delivered at the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) in China, the scientist and Huawei director set out the Tau Scaling law which the company believes enables breakthroughs in transistor density and system performance.
She explained the law proposes replacing geometric scaling with time scaling as a new guiding principle for the evolution of semiconductors and electronic systems.
Huawei is using the approach for its LogicFolding chip design architecture.
The executive said the upcoming generation of its Kirin chip used in Huawei smartphones “marks our first-ever successful implementation of LogicFolding”.
“It is built on a brand-new free logic design concept, expanding from a single-layer to a double-layer architecture”, she added, highlighting improved transistor density and power efficiency among other benefits.
“In the next ten years, we will move from local critical-path folding to full-scale and multi-layer folding, for full-stack optimisation from devices to systems”, He noted. “From 2026 to 2035, as a wide range of R&D exploration goes into products, the transistor density will rise, operating frequency will surge and we keep delivering cutting-edge mobile chips to the market”.
She added Huawei’s “solution is feasible and affordable”, with the performance of the new chips able to “fully compete” with those developed using other methods.
The company is currently restricted from sourcing various pieces of advanced chipmaking equipment due to U.S. restrictions, resulting in technology workarounds and a renewed focus on internal development.
Huawei noted the Tau Scaling law is also being referred to as Her’s Law in recognition of He Tingbo’s peers and colleagues.
Source: Mobile World Live
Image Credit: Huawei
Source: Tahawul Tech